Copper-Carbon Composite Heat Sink

Diamond micro-particles are precision-bonded with high-purity oxygen-free copper via powder metallurgy or brazing, achieving thermal conductivity of 550-950 W/m·K. The coefficient of thermal expansion can be tailored to match chip or ceramic packages, with custom shapes available. Widely used in IGBT power modules for new energy vehicles, liquid-cooled server heat sinks for data centers, industrial fiber lasers, and high-power LED lighting.