Product Center
Thermal diamond film
Ultra-high thermal conductivity diamond film, offering 5 times the thermal performance of copper for high-end heat dissipation and thermal management applications.
Material:CVD Diamond + Thermal Adhesive Layer
Application:5G base stations, power devices, LED thermal management, aerospace thermal control, and new energy vehicle battery thermal management
Shielding material
Electromagnetic shielding materials for protecting electronic devices from electromagnetic interference.
Material:Copper Foil / Aluminum Foil / Conductive Fabric / Conductive Foam
Application:Communication Equipment, Medical Devices, Automotive Electronics
CVD Carbon Thermal Spread Film
Ultra-high thermal conductivity films fabricated via pure chemical vapor deposition (CVD) achieve thermal conductivities up to 2000-2300 W/m·K. With exceptional thermal stability and atomic-level surface flatness, they are ideal for AI chip near-junction heat dissipation, high-end laser optical windows, 5G millimeter-wave device substrates, and quantum computing chip packaging.
Material:Pure CVD carbon materials
Application:AI chip near-junction cooling, high-end laser optical windows, 5G millimeter-wave high-frequency device substrates, and quantum computing chip packaging
Copper-Carbon Composite Heat Sink
Diamond micro-particles are precision-bonded with high-purity oxygen-free copper via powder metallurgy or brazing, achieving thermal conductivity of 550-950 W/m·K. The coefficient of thermal expansion can be tailored to match chip or ceramic packages, with custom shapes available. Widely used in IGBT power modules for new energy vehicles, liquid-cooled server heat sinks for data centers, industrial fiber lasers, and high-power LED lighting.
Material:Diamond + Oxygen-Free Copper Composite
Application:New Energy Vehicle IGBT Power Modules, Data Center Liquid-Cooled Server Heatsinks, Industrial Fiber Lasers, High-Power LED Lighting
Vacuum bright silver plating film
Vacuum Bright Silver Film (PET/PI/FEP/Glass Substrate) leverages four core properties—high conductivity, high reflectivity, electromagnetic shielding, and antimicrobial performance—to serve six key industries: Electronics & 5G Communications, Optics & Precision Instruments, Aerospace, New Energy Vehicles, Healthcare, and Photovoltaics/New Energy.
Material:PET/PI/FEP/Glass + Silver Layer
Application:Electronics/5G Communication (flexible circuits, electromagnetic shielding, display touch), Optics/Precision Instruments (high-reflectivity mirrors, infrared reflection, lighting), Aerospace (thermal control coatings, lightweight conductive materials), New Energy Vehicles (thermal management, smart cockpits, circuits), Healthcare (antibacterial devices, implantable electrodes, sensors), Photovoltaics/New Energy (PV backsheets, energy storage)
Copper Foil Flexible Connector
Flexible copper foil soft link for battery modules and electrical equipment
Material:T2 Electrolytic Copper Foil + Nickel Sheet
Application:Lithium-ion battery modules, electrical equipment, charging piles
Copper-coated film
Vacuum copper-plated film for electromagnetic shielding and conductive materials
Material:PET base film + copper layer
Application:Electromagnetic shielding, conductive materials, decorative materials
Gold-plated film
Vacuum gold-plated thin film for premium decoration and electronic materials
Material:PET base film + gold layer
Application:Premium Decor, Electronic Components, Handicrafts
Beryllium copper spring
High-elasticity beryllium copper springs for electronic connectors and contacts
Material:Beryllium Copper C17200/C17300
Application:Electrical Connectors, Switches, Relays
Aluminum foil
High-performance aluminum foil for new energy batteries, capacitors, and more.
Material:High-Purity Aluminum 1060/1070/1100
Application:New energy batteries, capacitors, packaging materials
Conductive connector
High-performance conductive connectors for electrical connections in electronic devices
Material:Copper Alloy/Stainless Steel + Gold/Silver Plating
Application:Communication Equipment, Automotive Electronics, Industrial Control
Absorbing Foam
Electromagnetic wave-absorbing materials for reducing electromagnetic interference and reflection
Material:Polyurethane foam + Absorptive coating
Application:Communication equipment, radar systems, microwave anechoic chambers
Conductive Silicone Rubber
Conductive elastomer material for electromagnetic shielding and sealing
Material:Silicone rubber + silver/copper/nickel conductive particles
Application:Aerospace, Military, and Communication Equipment
Shielding film
High-performance electromagnetic shielding film for electronic device protection
Material:PET substrate + metal coating
Application:Phone, tablet, laptop
Expanded Laminated Conductive Aluminum Foil
Laminated conductive aluminum foil for battery current collectors and shielding materials
Material:Aluminum foil + PET/PP laminated film
Application:Lithium-ion batteries, capacitors, electromagnetic shielding
Tin-plated copper braided mesh
Tin-plated copper wire braid for shielding and grounding
Material:Tinned copper wire
Application:Cable shielding, grounding connections, electromagnetic shielding
Metal Conductive Tape
Metal foil-backed conductive tape for EMI shielding and grounding
Material:Copper foil / Aluminum foil + Conductive adhesive
Application:Electronic devices, communication equipment, home appliances
Conductive Fabric Tape
Conductive fabric tape for EMI shielding and grounding
Material:Conductive tape + conductive adhesive
Application:Laptops, smartphones, and communication devices
Conductive silicone
One-component conductive silicone for electronic component bonding and shielding
Material:Silicone rubber + silver/nickel powder
Application:Electronic packaging, chip bonding, electromagnetic shielding
Shield
Metal shielding enclosure for electromagnetic interference (EMI) shielding in electronic devices
Material:Stainless Steel / Copper Alloy / Aluminum Alloy
Application:Mobile phones, communication modules, circuit boards
Absorbing rubber
Electromagnetic wave-absorbing rubber materials for reducing electromagnetic interference
Material:Rubber + Absorptive Filler
Application:Communication Equipment, Automotive Electronics, Military Industry
Conductive foam
Conductive foam for electromagnetic shielding; soft and easy to process.
Material:Polyurethane foam + conductive fabric/metal coating
Application:Electronic device shielding and enclosure cabinet sealing
Copper Foil
High-performance electrolytic copper foil for PCBs and lithium battery anode current collectors
Material:Electrolytic Copper T2/T3
Application:PCB, Lithium Batteries, Electromagnetic Shielding
Aluminum-coated film
Vacuum aluminum-coated film, high-barrier packaging material
Material:PET/OPP/CPP base film + aluminum layer
Application:Electronic components, electromagnetic shielding, decorative films
Ultra-low profile copper foil
Ultra Low Profile Copper Foil, also known as Extremely Low Profile or Compute Copper Foil, is designed for AI compute chips, high-speed PCBs, and advanced packaging. With an ultra-low surface roughness (Rz ≤ 1.0μm), it significantly reduces high-frequency signal transmission loss and enhances signal integrity. Ideal for high-end applications including high-speed/high-frequency PCBs, AI servers, 5G base stations, and advanced packaging substrates.
Material:High-purity electrolytic copper
Application:AI servers, high-speed PCBs, 5G base stations, advanced packaging substrates, and high-frequency communication equipment