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CVD Carbon Thermal Spread Film
Ultra-high thermal conductivity films fabricated via pure chemical vapor deposition (CVD) achieve thermal conductivities up to 2000-2300 W/m·K. With exceptional thermal stability and atomic-level surface flatness, they are ideal for AI chip near-junction heat dissipation, high-end laser optical windows, 5G millimeter-wave device substrates, and quantum computing chip packaging.
Material
Pure CVD carbon materials
Application Areas
AI chip near-junction cooling, high-end laser optical windows, 5G millimeter-wave high-frequency device substrates, and quantum computing chip packaging
Key Features
- Thermal conductivity 2000-230 W/m·K
- High thermal stability
- Atomic-level surface flatness
- Extremely pure
- Self-supporting thin films or silicon-based substrates