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Thermal diamond film
Ultra-high thermal conductivity diamond film, offering 5 times the thermal performance of copper for high-end heat dissipation and thermal management applications.
Material
CVD Diamond + Thermal Adhesive Layer
Tolerance
Thickness tolerance ±0.001mm
Surface Finishing
High-gloss / Mirror
Application Areas
5G base stations, power devices, LED thermal management, aerospace thermal control, and new energy vehicle battery thermal management
Key Features
- Ultra-high thermal conductivity (5× that of copper), excellent dielectric properties, low coefficient of thermal expansion, and high-temperature corrosion resistance